SWG-5 115x115x66 E100 A PEEK

Highlights

• Large contact area between wafer and gripper for maximum grip.
• Low air consumption.
• Low vacuum level.
• High flow rate.
• Controlled air discharge (optional).
• Rapid venting of vacuum chamber.
• Gripper surface e.g. made of PEEK (Polyetheretherketone).
• Modular concept with various surface materials, sensors, and optional shock absorption elements.

Your advantages

• High speed, high accuracy handling for cycle times less than 1 second.
• Low operating costs .
• Gentle gripping with minimal torsional forces and minimal conchoidal fracture risk.
• Reliable gripping and handling even of deformed and broken wafers.
• No contamination of process area with silicon dust or fragments.
• Precise positioning and very short cycle times.
• Minimal surface contamination and reduction of blind spots.
• Optional breakage detection through backlit gripper surface.

Application

• Fully or partially automated production of silicon PV cells with maximum process stability, production line uptime, cell efficiency and line output.
• Extremely fast, reliable, precise and gentle handling of photovoltaic wafers and cells.
• Loading and unloading from stacks and conveyor belts.
• High accuracy positioning during and after the visual inspection process.
• Wafer breakage detection "on the flight".

Construction

• Modular over-all design with contact surface, robot interface, sensors and optional features.
• Gripper sizes available for standard cell sizes 125 mm and 156 mm.
• Various contact surfaces available (e.g. transparent).
• Integrated pneumatic vacuum generation with high suction rate and controlled air discharge (accessory).
• Low weight plastic components.